Mijing Z20 Pro Motherboard Middle Layer Planting Tin Platform for iPhone X to 17Pro Max

Key Features:

• Wide Compatibility: The platform is designed to support a comprehensive range of iPhone models, from the iPhone X to the latest iPhone 17 Pro Max. It often comes as a kit with multiple specific stencil modules.

• Magnetic Fixture: It features a robust magnetic base and fixture design to securely hold the motherboard or IC in place, ensuring precise alignment and preventing movement during the delicate reballing process.

• High-Quality Materials: The platform is typically crafted from durable, high-quality aluminum alloy and the stencils from high-precision steel, ensuring longevity and resistance to deformation during heating.

• Precision Engineering: The stencils are ultra-thin and precisely engineered to match the BGA (Ball Grid Array) pad layouts of the iPhone motherboards, facilitating accurate solder paste application and ball formation.

• High-Temperature Resistance: The materials are built to withstand the high temperatures required for BGA reballing and soldering with a hot air gun without deforming, ensuring reliable and safe repairs.

• Multi-functionality: Besides reballing, the platform serves as a general repair fixture for various tasks, including welding, de-gumming (removing adhesive from chips), and positioning components.