YCS R1 Ultra 1450W High Power Hot Air Gun Rework Station for Mobile Phone Motherboard BGA Chip Soldering Desoldering and Repair. Ultra-fast heating, efficient desoldering and soldering electronic PCB CPU BGA chips components. Adjustable temperature, intelligent welding, precise control, digital display.  Suitable for mobile phone repair or tablet PC repair.

1. 1450W high power performance, ultra-fast heating, efficient desoldering and soldering components, ideal for PCB and microchip repair.
2. Adjustable temperature and airflow control, easily set the desired temperature (100°C - 500°C), and switch between straight air and cyclonic air for precise operation
3. Intelligent digital display and precise control, advanced LED screen provides real-time temperature and airflow monitoring, convenient and professional operation, allowing you to control everything.
4. Smart touch and multi-mode function innovative light-sensing interactive technology, automatic temperature adjustment and memory mode for seamless operation!
5. Versatile and global voltage compatibility Applicable to AC110V/220V, it is ideal for professional repair engineers around the world. It is an ideal choice for BGA, SMD, IC and PCB repair.
6. Three working modes: large chip mode, small chip mode, and curve mode.
7. 6-stage temperature control, rapid heating, double efficiency. Reshape the aesthetics of desoldering with three-sided transparent appearance. The appearance and the inside are consistent, the solid materials are not afraid of comparison.